佳值集團 PANEL GROUP

	Underfill Fillers
	UV (Curable Adhesive)
	Wide Field Adhesives
	Low Temperature Curing Adhesives
	Low-temperature, conductive adhesives (silver glue)
	Complete Liquid Adhesives
	Low-temperature, curing softable adhesives
	Adhesives for Loudspeakers
	Adhesives for Electronics Industry
	Adhesives for Automobile Interior Purposes

Underfill

Used in handheld electronics.
Reworkable for critical BGA & CSP components.
Penguin Cement 991/992/991D - stronger adhesive developed for BGA and CSP tin ball welding.

Features：
• Curing quickly in low temperatures. (500μm membrane, hardens at 70°C in 5 seconds)
• Component rework possible with excellent performance.(Diagram of actual example)
• Reliable storage at room temperature (20°C~30°C) with excellent performance.
• Low viscosity adhesive with high water permeability.
• Excellent electrical insulation.
• Fulfill low halogen requirements. ( Cl<900ppm , Br<900ppm , Cl+Br <1500ppm)

Table of Features

Serial No.	991	992	991D	Reference
Standard hardening conditions	80°C x 10 minutes	80°C x 10 minutes	80°C x 10 minutes
Viscosity(mPa.s)	5400	8360	27000	BH Type 20°C
Viscosity ratio	1.00	1.08	2.0	2/20rpm(23°C)
Specific weight	1.08	1.08	1.08	20°C
Initial hardening time needed	7	7	5	80°C/200μm
Hardness	85	95	95	Model JISA JISK-6301
Tg	–85	–85	–80	TMA
Volume Resistivity(Ωcm)	1.2 x 1012	1.5 x 1013	2.1 x 1013	20°C JIS-K6911
Insulation Resistivity(Ωcm)(85°Cx85RH)	3.0 x 109	1.2 x 1010	2.0 x 1010	JIS2 100V
Electrical conduction rate(ε)	4.0	3.86	3.79	JIS-K6911 1MHz20°C
Dissipation factor(tan δ)	0.034	0.050	0.037	JIS-K6911 1MHz20°C
Adhesiveness(N/mm2)	7.0	10.9	9.5	FR-4
Water absorption(%)	0.85	1.10	1.00	Boil 2 hours

Panel Trading Co.,LTD.
7th Floor,No.168,Song-Jiang Road,Zhong-Shan District,Taipei City 10459,Taiwan.
TEL：+886-2-25711191#308 FAX：+886-2-25641810
E-mail Address : sam.yang@panel.com.tw

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