|
 |
|
| Low-temperature
,curing conductive adhesives (silver glue) |
 |
Conductive adhesives
• Suitable for non heat-tolerant materials that require electrical
conductivity.
• Alternative to welding.
• Fast hardening, thus increases productivity.
• Non-dissolvent, greatly reduce contamination.
• Fulfills low halogen requirements( Cl<900ppm,Br<900ppm,Cl+Br
<1500ppm) |
 |
| |
CA-45 |
CA-46 |
| Main
Component |
Silver |
Silver |
| Color,
external appearance |
Silver color
paste |
Silver color
paste |
| Viscosity |
28 Pa•s |
12 Pa•s |
| TI
Value |
6.5 |
3.85 |
| Storage
conditions |
Below -10°C以下 |
Below -10°C |
| Standard
hardening conditions |
90°CΧ60
minutes |
90°CΧ60
minutes |
| Shear
strength |
3.5 MPa |
3.5 MPa |
| Chip
adhesive |
60 N |
60 N |
| Tg
transfer point |
91°C |
91°C |
| Young's
Modulus |
2.0 GPa |
2.0 GPa |
| Special
Features |
High dependability,
non-dissolvent |
High dependability,
non-dissolvent |
|
|
 |
Panel Trading Co.,LTD.
7th Floor,No.168,Song-Jiang Road,Zhong-Shan District,Taipei
City 10459,Taiwan.
TEL：+886-2-25711191#306 FAX：+886-2-25641810
E-mail Address : akira.yang@panel.com.tw |
|
|
|
|
|